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2002
 ¼s½÷¹q¤l¤G¼t·s«Ø¤uµ{
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2001
 º~½U¤T¼tC/R¤ÎMEP·s«Ø¤uµ{
²ÎÄ_¥ú¹q¤@¼tMEP¤uµ{
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2000
 «aµØ¬ì§Þ(ªÑ)·¨±ö¼tµL¹Ð«Ç·s«Ø¤uµ{
TSMC FAB14 MEP·s«Ø¤uµ{
TSMC FAB14 µL¹Ð«Ç·s«Ø¤uµ{
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TSMC FAB12 MEP·s«Ø¤uµ{
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TSMC FAB7 PE LAB¤uµ{
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1999
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1998
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1997
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1996
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1995
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Semiconductor,TFT LCD & Electronic Factory Experience

PROJECT
SCOPE OF WORKS
CLASS 1/10 CLEANROOM
CLASS 100 CLEANROOM
CLASS 1000 CLEANROOM
UPW
GAS
CHEMICAL
PROCESS SUPPORT
GENERAL MECHANICAL
ELECTRICAL
LIFE SAFETY
STATUS
WINBOND FAB I
D & B
D & B
D & B
D & B
D & B
D & B
D & B
COMPLETED
WINBOND FAB II
D & B
D & B
D & B
D & B
D & B
COMPLETED
WINBOND FAB III
£¾ (NOTE 2)
D & B
D & B
D
COMPLETED
MACRONIX FAB I
D & B
D & B
D & B
D & B
D & B
COMPLETED
MACRONIX FAB II
B
B
COMPLETED
TSMC FAB III
D & B
D & B
D & B
D & B
D & B
COMPLETED
TSMC FAB IV
D & B
D & B
D & B
D & B
D & B
COMPLETED
NOTE:
1. CONCEPT DESIGN
2. DETAILED DESIGN AND CONSTRUCTION DRAWING
3. D : DESIGN, B : BUILD

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